Epoxy Resin - Epoxy Molding Insulator (2)
This is an introduction to "epoxy resin."
If you have any questions, please feel free to contact us.
- Company：浪華合成
- Price：Other
Epoxy Resin Product List and Ranking from 24 Manufacturers, Suppliers and Companies | IPROS GMS
Last Updated： Aggregation Period:Apr 15, 2026～May 12, 2026
This ranking is based on the number of page views on our site.
Epoxy Resin Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Apr 15, 2026～May 12, 2026
This ranking is based on the number of page views on our site.
- 寺田 Tokyo//Electronic Components and Semiconductors
- 田岡化学工業 Tokyo//Chemical
- アール・イー・ティー Saitama//Trading company/Wholesale
- ハルツォク・ジャパン Tokyo//Testing, Analysis and Measurement
- 5 マーケットリサーチセンター Tokyo//Service Industry
Epoxy Resin Product ranking
Last Updated： Aggregation Period:Apr 15, 2026～May 12, 2026
This ranking is based on the number of page views on our site.
- <Embedding Resin> Epoxy Resin 'HERZOG EPO' [Free Sample] ハルツォク・ジャパン
- [Material] Bifunctional Epithioether Resin 'TBIS-AHSP' 田岡化学工業
- Epoxy resin for CFRP laminated repair GM-6815 アール・イー・ティー
- 4 EpoKwick FC "Epoxy Resin" ITWジャパンビューラー ビューラービジネスユニット東京本社
- 4 General-purpose potting resin TE-6302 low viscosity/high strength product 寺田
Epoxy Resin Product List
1～30 item / All 62 items
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Delivery Example: Epoxy Resin Sealing with Epoxy Resin
Perfect for those considering sealing with epoxy resin!
At Nagahama Gosei, we accurately understand the properties of epoxy resin and use materials that meet our customers' needs to provide molded products that satisfy them. For more details, please contact us or refer to our catalog.
- Company：浪華合成
- Price：Other
Epoxy resin "EPOXY"
Ideal for those aiming for edge observation! Introducing a black epoxy resin with very low shrinkage.
Epoxy resin is considered to have very low shrinkage among thermosetting materials. This product can be used for various observations of metal materials, including edge observation, appearance observation, hardness testing, and microstructure observation. Due to its low shrinkage and the difficulty of creating gaps between the resin and the material, this resin is particularly suitable for those aiming for edge observation. 【Features】 ■ Low shrinkage ■ Difficult to create gaps between the resin and the material ■ Manufactured by PRESI *For more details, please refer to the PDF document or feel free to contact us.
- Company：北川グレステック 本社
- Price：Other
Regarding the curing temperature of epoxy resin during sample encapsulation.
Even with larger-sized implementation boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.
Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections. However, since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener. When embedding large samples such as printed circuit boards and touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we investigated how much heat is actually generated during curing. For more details, please refer to the PDF download below. 【Overview】 ■ Temperature profile acquisition - Without heat prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat prevention treatment for a large amount of resin (large container) ■ Resin embedding is possible even for larger printed circuit boards without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.
- Company：アイテス
- Price：Other
![[Analysis Case] Qualitative Analysis of Epoxy Resin](https://image.mono.ipros.com/public/product/image/937/2000244304/IPROS5968891087138350395.jpg?w=280&h=280)
[Analysis Case] Qualitative Analysis of Epoxy Resin
Estimation of components is possible through TOF-SIMS analysis.
Epoxy resin is widely used in electronic component applications such as printed circuit boards and IC encapsulants due to its excellent mechanical properties, chemical resistance, and electrical insulation. Data measured by TOF-SIMS was obtained regarding the reagents of bisphenols, which are commonly used as raw materials for epoxy resin. By comparing the sample measurement data with standard data at MST, it is possible to investigate the origin of the detected fragment ions and estimate the materials used in the epoxy resin.
- Company：一般財団法人材料科学技術振興財団 MST
- Price：Other
![[English Market Research Report] Global Market for Epoxy Resins](https://image.mono.ipros.com/public/product/image/c7d/2001182936/IPROS4030065908563980754.png?w=280&h=280)
[English Market Research Report] Global Market for Epoxy Resins
"Free samples" are currently being offered! Please check the application method from the [PDF download] button, or apply directly through the related links.
The epoxy resin market size is expected to grow at a CAGR of 6.3% during the forecast period, reaching 15.9 billion USD by 2030. In 2022, the market reached 2,804.31 kilotons, experiencing a growth of 5.5% from 2019 to 2022. Furthermore, epoxy resin-based composites are also used in the manufacturing of wind turbine nacelles and rotor hubs. The nacelle houses critical components such as gearboxes, generators, and control systems, while the rotor hub connects the blades to the main shaft. Therefore, the increasing adoption of renewable energy is a key factor driving market growth.
- Company：グローバルインフォメーション
- Price：500,000 yen-1 million yen
Book: Measurement and Evaluation Methods of Resin Hardness and Curing Behavior
Understanding the hardening behavior makes the measurement and analysis methods clear!
○Publication Date: July 13, 2007 ○Format: B5 size, hardcover, 575 pages ○Price: 60,000 yen (excluding tax) → STbook member price: 56,952 yen (excluding tax) ○Authors: Kiichi Hasegawa, Osaka Municipal Industrial Research Institute Nobuyuki Furukawa, National Institute of Technology, Sasebo College Satoshi Yamazaki, Mitsui Chemicals Polyurethane Co., Ltd. Akihiro Matsumoto, Osaka Municipal Industrial Research Institute Tatsuya Yamagami, The University of Tokyo Takeshi Tanaka, A&D Company, Limited Toru Fuji, Totsuya Echo Co., Ltd. Mikio Akutsu, Cashew Co., Ltd. Yasuyuki Takimoto, Advisor, Photopolymer Discussion Group Kenji Suda, Kawakami Paint Co., Ltd. Motokyo Mito, Osaka City University Koji Adachi, The University of Tokyo Kinji Taki, Shizuoka University Shozo Nakamura, Hiroshima Institute of Technology Masaki Yoshii, Hitachi Chemical Co., Ltd. Jun Sekiguchi, Risotech Japan Co., Ltd. Shuichi Takahashi, AZ Electronic Materials Co., Ltd. Others
- Company：S&T出版
- Price：10,000 yen-100,000 yen
Basic Knowledge Material: What is the epoxy resin needed for pipe repair?
You can change the properties by adding additives to the hardener!
This document introduces the epoxy resin necessary for pipe repairs. It provides a detailed explanation of Phamanite's epoxy resin, mixing, and UV protection. This is a useful reference, so please take a moment to read it. 【Contents】 ■ What is epoxy resin? ■ Phamanite's epoxy resin ■ Mixing epoxy resin ■ UV protection for resin *For more details, please download the PDF or feel free to contact us.
- Company：富士ファーマナイト
- Price：Other
Comprehensive Catalog of Circuit Materials
A lineup of high heat-resistant tri-functional epoxy resins and bisphenol E type epoxy resins.
This catalog is a comprehensive catalog featuring a wide range of products from circuit materials to circuit processed products handled by Print Tech Co., Ltd. We introduce various products such as castor oil modified epoxy resin and transparent, low-viscosity, flexible epoxy resin. [Featured Products] ■ High heat-resistant trifunctional epoxy resin 'TECHMORE VG3101L' ■ Bisphenol E type epoxy resin 'EPOX MK R710/R1710' ■ Castor oil modified epoxy resin 'EPOX MK R151' ■ Transparent, low-viscosity, flexible epoxy resin 'EPOX MK R540' ■ Rubber modified solid epoxy resin 'EPOX MK SR35K/SR3542', etc. *For more details, please download the PDF or contact us.
- Company：プリンテック
- Price：Other
Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-6430
Room temperature curing type × high thermal conductivity 2.4W/mK! A two-component epoxy resin with excellent heat dissipation insulation. Suitable for thermal management of motors, coils, and sensors.
"TE-6430" is a two-component, room-temperature curing epoxy resin (hard type) developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to its ability to cure at room temperature, and it remains low in viscosity after mixing, making it easy to handle. This product has a thermal conductivity of 2.4 W/m·K, making it effective for heat dissipation measures for electronic components that generate heat. Additionally, it possesses flame retardancy equivalent to UL94 V-0 (5mm thickness), allowing for safe use in applications where safety is a concern. 【Features】 ■ Two-component, room-temperature curing epoxy resin (hard type) ■ High thermal conductivity: 2.4 W/m·K ■ Flame retardancy: UL94 V-0 equivalent (5mm thickness) ■ Good workability with low viscosity after mixing ■ High insulation and low water absorption improve the reliability of electronic devices *For more details, we have published the product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.
- Company：寺田
- Price：Other
Newly Developed Product: Two-Component Room Temperature Curing Epoxy Resin TE-7170K
Room temperature curing × high thermal conductivity × flexibility! An epoxy resin suitable for stress relief. Low viscosity and good workability, equivalent to UL94 V-0.
The "TE-7170K" is a two-component, room temperature curing epoxy resin developed for heat dissipation insulation applications in electronic and electrical equipment. It cures at 25°C without the need for heating equipment, making it energy-efficient and easy to handle on-site. This product has a thermal conductivity of 0.9 W/m·K, making it effective for heat dissipation measures for heat-generating components. Additionally, the resin design incorporates flexibility to absorb and alleviate stress, helping to suppress the occurrence of cracks in substrates and components. It is suitable for applications that require high reliability. With a low viscosity design of 3,500 mPa·s (25°C), it excels in filling details and provides a sufficient working time of approximately 3 hours. 【Features】 ■ Two-component, room temperature curing epoxy resin (mixing ratio 100:20) ■ Effective for heat dissipation measures with a thermal conductivity of 0.9 W/m·K ■ Flexible design that effectively alleviates stress and prevents cracking ■ Good workability with low viscosity and approximately 3 hours of usable time *For more details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.
- Company：寺田
- Price：Other
EpoKwick FC "Epoxy Resin"
Epoxy resin with a short curing time.
■Can be embedded in 2 hours of curing time ■Low viscosity, thoroughly penetrates gaps, cracks, and voids ■Strong adhesion
- Company：ITWジャパンビューラー ビューラービジネスユニット東京本社
- Price：Other
Epoxy resin for GFRP production GM-6600 (for glass cloth)
For the production of high-performance GFRP.
- Epoxy resin ideal for fiberglass cloth - Adheres without delaminating fiberglass cloth or mats - Allows for layered repairs, enabling thickness adjustment from thin to thick - Has a viscosity that is not too runny, making it easy to adjust layers - Can be used without dissolving foam products like polystyrene
- Company：アール・イー・ティー
- Price：Other
Low viscosity, thin-walled casting high transparency epoxy resin GM-9002
You can create clear parts and a skeleton model.
- Epoxy resin suitable for thin-walled casting (thickness of 5mm or less) - Slow yellowing due to aging - Low viscosity, making it difficult for bubbles to remain even at normal pressure - Good balance of rigidity, making it less likely to break during demolding - At room temperature (23°C), flowability decreases in about 10 minutes and cures in one day - Curing speed can be adjusted with heat treatment (not exceeding 50°C) * Curing with a thickness of more than 5mm can generate high temperatures (over 100°C) due to exothermic reactions, which is dangerous.
- Company：アール・イー・ティー
- Price：Other
Epoxy resin for CFRP laminated repair GM-6815
For FRP repairs and metal lamination repairs.
This resin combines the characteristics of CFRP manufacturing epoxy resin GM-6800 and surface coating/multipurpose epoxy resin GM-1508. It has excellent impact resistance and flexibility, good impregnation properties, and is capable of layered repairs.
- Company：アール・イー・ティー
- Price：Other
Interview article
Having experienced the collaboration of industry, academia, and government, and even management of a company!!!
Technical Consultation Office, LLC - Hanyou Chemical Research Institute We provide careful support for companies facing challenges related to research and development of raw materials and materials, manufacturing processes, PR, and more. We can conduct demonstration experiments and prototypes in our dedicated laboratory, starting from small quantities. Additionally, we offer consultations on the training of technical staff and technology succession. Please access the related links below.
- Company：播羊化学研究所
- Price：Other
Epoxy Resin - Epoxy Molding Insulator (1)
This is an introduction to "epoxy resin."
If you have any questions, please feel free to contact us.
- Company：浪華合成
- Price：Other
Delivery example: Epoxy resin - Manufacturing of epoxy insulators
Perfect for those considering the production of insulators using epoxy resin!
At Nagoya Composite, we accurately understand the properties of epoxy resin and use materials that meet our customers' needs to provide molded products that satisfy them. For more details, please contact us or refer to our catalog.
- Company：浪華合成
- Price：Other
![<Embedding Resin> Epoxy Resin 'HERZOG EPO' [Free Sample]](https://image.mono.ipros.com/public/product/image/23c/219101021/IPROS18738777808772699247.jpeg?w=280&h=280)
<Embedding Resin> Epoxy Resin 'HERZOG EPO' [Free Sample]
Main agent of epoxy resin. It is a two-component resin that is mixed with an epoxy hardener to embed samples. It is the optimal resin for sample embedding.
We offer two types of epoxy resin. Free samples will be sent along with the hardener (non-toxic). Please contact us if you are interested. <HERZOG EPO> This is an epoxy base resin designed with optimal hardness, adhesion, transparency, and shrinkage for embedding and polishing samples. <HERZOG EPO Low Viscosity> This is a low viscosity type of epoxy base resin. It easily penetrates gaps in samples and is suitable for complex shapes. It also produces minimal bubbles. ☆You can also purchase it on Amazon. Please check the link below.
- Company：ハルツォク・ジャパン
- Price：Less than 10,000 yen
![[Book] Formulation Design and High Functionality of Epoxy Resins (No. 2222)](https://image.mono.ipros.com/public/product/image/272/2001024035/IPROS89859672447151537439.jpeg?w=280&h=280)
[Book] Formulation Design and High Functionality of Epoxy Resins (No. 2222)
Available for trial reading - High heat resistance, high thermal conductivity and insulation, low dielectric constant, reinforcement -
★ The "concrete measures" that respond to the latest electronics implementation materials such as high-frequency substrates and semiconductor encapsulation can be understood from the examples of advanced companies! ★ Optimal selection of hardeners, usage amounts, and optimization of curing process conditions! Reduction of environmental impact through the realization of low-temperature rapid curing! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book 1 ● High heat resistance and high thermal conductivity ・ Long-term heat resistance for 5G/6G compatibility, power modules, etc. ・ Increased heat resistance through benzoxazine and bismaleimide modification ・ High filling of fillers with high thermal conductivity ・ Low dielectric constant that trades off with heat resistance ● Toughening and high strength ・ Compatibility with processability as CFRP matrix resin ・ Coatings with excellent self-healing and corrosion resistance ● High adhesion ・ Multi-material compatibility ・ Functions with excellent workability such as high viscosity and high room temperature stability ● Environmental considerations ・ Development of plant oil-derived resins ・ Recycling technology for epoxy resins and CFRP ・ Development of curing processes with low CO2 emissions ● Latest technologies and trouble countermeasures ・ Low-temperature rapid curing technology for epoxy resins ・ Countermeasures for mixing unevenness and troubles with hardeners ・ Data-driven approaches using MI ・ Evaluation of cured products containing many auxiliary materials
- Company：TECHNICAL INFOMATION INSTITUTE CO.,LTD
- Price：10,000 yen-100,000 yen
About the curing temperature of epoxy resin free from hazardous substances.
We conducted measurements to reconfirm the temperature at which heat is generated during hardening!
We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat prevention treatment for resin embedding. Without this treatment, the temperature can rise to 138°C during curing. However, with the heat prevention treatment applied, we were able to keep the heat generation during curing to within 30°C, even with a large amount of resin. 【Measurement Results】 ■ Without heat prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing. ■ With heat prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C. *For more details, please download the PDF or feel free to contact us.
- Company：アイテス
- Price：Other
![[Analysis Case] TDS Analysis of Epoxy Resin](https://image.mono.ipros.com/public/product/image/0d8/2000459847/IPROS21778330137494502439.jpeg?w=280&h=280)
[Analysis Case] TDS Analysis of Epoxy Resin
It is possible to investigate the degassing behavior of organic matter in a vacuum.
Epoxy resin is used as a semiconductor encapsulant, as well as an adhesive and for vacuum leak prevention both inside and outside vacuum devices. However, even after curing, heating may cause outgassing, which can negatively affect products and equipment. TDS (Thermal Desorption Gas Analysis) allows for monitoring outgassing components by heating the sample in high vacuum (1E-7 Pa) or while maintaining a constant temperature. Below, we present a case study investigating the outgassing behavior of epoxy resin using TDS with temperature maintenance.
- Company：一般財団法人材料科学技術振興財団 MST
- Price：Other
Book: "Design and High Functionality of Epoxy Resin Formulations"
You can understand the specific formulation design of epoxy resin! A book that will be useful for technology development and product development!
○Publication Date: August 20, 2008 ○Format: B5 size hardcover, 249 pages ○Price: 55,000 yen (excluding tax) → STbook member price: 52,190 yen (excluding tax) ○Authors: Ichiro Ogura (DIC Corporation) / Yuya Morimoto (Air Products Japan, Inc.) / Masahiko Yamanaka (Shin Nihon Rika Co., Ltd.) / Hiroshi Moriyama (DIC Corporation) / Noboru Mizobe (Shikoku Chemical Industry Co., Ltd.) / Kenji Ohashi (Hokko Chemical Industry Co., Ltd.) / Toshio Nonaka (Toray Industries, Inc.) / Yoshinobu Nakamura (Osaka Institute of Technology) / Hajime Kishi (University of Hyogo) / Hirofumi Nishida (Nagase ChemteX Corporation) / Yasuyuki Kamitani (Osaka City Industrial Research Institute) / Masafumi Kaji (Nippon Steel Chemical Co., Ltd.) / Haruhiko Maeda (Sumitomo Bakelite Co., Ltd.) / Toshio Shimizu (Toshiba Corporation) / Miyuki Harada (Kansai University) / Shigeru Koshibe (Aipack Co., Ltd.) / Hiroyuki Yano (Nippon Steel Chemical Co., Ltd.) / Yutaka Tsujimura (Nagase ChemteX Corporation) / Nobuaki Tomita (Nippon Paint Co., Ltd.) / Yutaka Hatakeyama (NTT Advanced Technology Corporation) / Nobuyuki Sato (Toray Research Center, Inc.)
- Company：S&T出版
- Price：10,000 yen-100,000 yen
Epoxy resin
Excellent in the manufacturing of liquid paint and resin with high-quality specifications.
To be stored in a dry, cool place away from exposure to sunlight, it should be kept in original sealed containers for several months from the manufacturer's date. To facilitate handling and optimal storage life, the epoxy resin dispersion should be stored in sealed containers at temperatures between 23°F (-5°C) and 104°F (40°C). Ensure that the product does not freeze. Do not leave uncovered products for extended periods to prevent skinning or surface drying. If the need arises to store partially filled plastic drums, replace the top sheet of plastic on the surface of the liquid product.
- Company：東莞広通化工製品
- Price：500,000 yen-1 million yen
epoxy resin
Excellent in the manufacturing of liquid paints and resins with high-quality specifications.
To be stored in a dry, cool place away from exposure to sunlight, it should be kept in original sealed containers for several months from the manufacturer's date. To facilitate handling and optimal storage life, the epoxy resin dispersion should be stored in sealed containers at temperatures between 23°F (-5°C) and 104°F (40°C). Ensure that the product does not freeze. To prevent skinning or surface drying, do not leave the product uncovered for extended periods. If it becomes necessary to store partially filled plastic drums, replace the top sheet of plastic on the surface of the liquid product.
- Company：東莞広通化工製品
- Price：500,000 yen-1 million yen
![[Material] Bifunctional Epithioether Resin 'TBIS-AHSP'](https://image.mono.ipros.com/public/product/image/2056411/IPROS17026620358986713504.png?w=280&h=280)
[Material] Bifunctional Epithioether Resin 'TBIS-AHSP'
Can be used for coatings on various substrates, as well as sealing agents and adhesives for organic EL and LEDs!
This document provides information about the bifunctional episulfide resin "TBIS-AHSP." It introduces "general physical properties" such as appearance, odor, episulfide content, viscosity, and chemical substance control law. Additionally, it includes diagrams and images comparing low-temperature curing properties and high transparency with Bis-A type epoxy resins. Please take a look. [Contents] ■ General physical properties ■ Features ■ Applications *For more details, please download the PDF or feel free to contact us.
- Company：田岡化学工業
- Price：Other
![[Information] TBIS Series Products List](https://image.mono.ipros.com/public/product/image/2056411/IPROS1578762777753899486.png?w=280&h=280)
[Information] TBIS Series Products List
Introducing products that can be used as raw materials and modifiers for special resins (optical materials, electronic materials)!
This document includes information about the "TBIS series," such as bisphenol derivatives and acid anhydride derivatives. We introduce "epoxy resin," which features a special structure containing a fluorene skeleton, demonstrating excellent heat resistance and high transparency. Additionally, we also feature "episulfide resin," which has low odor specific to sulfur compounds and offers excellent transparency. [Contents] ■ Bisphenol derivatives ■ Acid anhydride derivatives ■ Epoxy resin ■ Episulfide resin ■ Acrylate *For more details, please download the PDF or feel free to contact us.
- Company：田岡化学工業
- Price：Other
Related Categories of Epoxy Resin
- Hardening epoxy resin
- High thermal conductivity epoxy resin
- Room temperature curing epoxy resin
- Transparent Epoxy Resin
- Adhesive epoxy resin
- For epoxy resin
- Liquid epoxy resin
- Modified Epoxy Resin
- UV curable epoxy resin
- Room temperature curing epoxy resin
- Hardened epoxy resin
- Insulating Epoxy Resin
- Mortar epoxy resin
- Chlorinated epoxy resin
- Solvent-free epoxy resin
- Fabrication epoxy resin
- Hardening epoxy resin
- Exothermic epoxy resin
- Thermal conductive epoxy resin
- Water-based epoxy resin
